The work after the fab
Getting a chip made has become possible for small teams and individuals. Preparing it for a board or prototype takes additional processing, coordination and logistics.
Why Outerfab
Open shuttles and small runs now give designers real silicon. What comes back is a wafer, or a bag of bare die. Packaging houses want a minimum order that a first chip cannot justify, so the die sit in a drawer.
Outerfab coordinates the work between bare silicon and a usable prototype or small batch: preparation, bonding, testing, packing and shipping.
Who we are
Giovanni Schirinzi
Supply chain, product development and marketing.
Stuart Childs
Production, operations and technical project management.
We work with engineers and manufacturing partners for PCB design and layout review, bonding schematics and pad maps, panelisation, and electrical test planning.
Based in Shenzhen.
notable partners
Tiny Tapeout
A shared path from small designs to real chips.
wafer.space
An open path from custom designs to real chips.
Outerfab is an independent company open to working with anybody requiring chip on board and related silicon services.