Electrical testing for bonded boards

The standard method checks for three electrical faults on the pads included in the agreed test.

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• Open. The wire does not connect the die pad to the board pad.
• Short to ground. The wire or its pad touches ground.
• Short to neighbour. Two wires touch each other.

Signal pads can be measured through the die's ESD structures at three currents: 10 µA, 100 µA and 1 mA. Supply pads with decoupling capacitors use a capacitor-charge measurement instead.

We can create custom testing methods if you require something different to the standard testing procedure.

We need your expected readings to decide whether the measured result is correct for your die. Send this with the layout:

• Which pins to probe after bonding.
• Expected diode readings from signal pins to ground.
• Pins that should be shorted together, such as ground pads.
• Pins that should read open.

Before production, a testing method will be confirmed.

Details to agree for the report include:

• Board or panel identity and position.
• Pass or fail against the agreed readings, with failed boards counted.
• Test timestamp and tester identification.
• Agreed marking and handling of failed boards.