Chip-on-board wire bonding
We attach bare die to your PCB, wire-bond the agreed pads and cover the assembly in hard epoxy. Test coverage is defined for each job.
What is chip on board
how it works
what we need
- Die, in a waffle pack, on a film frame or on tape and reel, with 10 to 20% spares.
- A pad coordinate table or die layout, with pin 1 marked.
- A bonding diagram, or ask us to help draw one.
- Your board design, or a request to use our breakout template.
- What to probe after bonding, and the readings to expect.
what we provide
- Bonded boards made to specification.
- Test results according to the agreed scope.
- Remaining die returned as agreed.
Process options
What it costs
The quote lists the job's cost drivers as separate line items.
- Die size and pad count More pads is more bonding time.
- Quantity Setup and non-recurring engineering costs matter most on small runs. Unit costs come down from 500 units and above, quoted as a separate line item.
- Wire Gold costs several times more per die than aluminium.
- Board Panelisation can help to reduce costs.
- Test coverage According to the complexity of your requirements.
- Shipping and packing Where it goes, and how it is packed.
How a job runs
- You send the details Die size, pad count, quantity, wire, glob-top, board status, deadline. Share these details through the contact form; we can clarify the rest together.
- We review and quote We may ask follow-up questions before sending a detailed quote.
- Design review We check your board against the rules above before anything is ordered.
- You ship the die We tell you what the customs paperwork needs; an export compliance confirmation is part of the order. See shipping die to China.
- A trial panel, then the run We recommend bonding a small quantity of die for testing first, before completing the rest of the order.
- Report and ship Once production is completed we will share the results before packing your boards up and sending them to you.
Questions
Can you bond die from Tiny Tapeout or wafer.space?
Yes. Most of what we bond comes from those runs, on the standard slot sizes.
Can you bond die to die?
It is not a standard service. Send the geometry and we will say whether we can and what it would take.
Can I get boards without glob-top, for probing?
Yes, ask for it in the message. The bonds are fragile until they are covered.
Do you test before encapsulation?
Tell us in the message if you need it, and we will say whether it is possible for your job.
What happens to failed boards?
Agree failed-board handling in the job scope. If testing is included, the report states the recorded result.
What if my die is not a standard slot size?
Send the dimensions and the pad map. Non-standard is normal here.