Wafer dicing and division
You have a wafer, or part of one, and you need separate die in a form a bonder can use. We arrange the backgrinding, dicing and put the die in a waffle pack.
About
Wafer processing partners are not commonly set up for small batches. We work with multiple partners and have agreements in place for such requirements.
- Backgrinding. Thinning the wafer before it is cut. Wafers are made thick to stay rigid during fabrication, and dicing a thick wafer chips it and can damage your die.
- Dicing. Cutting the wafer into individual die. Most jobs use saw cutting; laser dicing is also available if required.
- Division. Sorting the cut die into a waffle pack.
What we need from you
- Wafer diameter and count.
- Die size and scribe width.
- Target thickness.
- Output format: waffle pack.
- Wafer map or ink dots, showing which die to leave out.
Not sure of a value? Say so in the message; we will ask the partner.
Questions
Where does the dicing happen?
At partner houses in Asia, chosen for the job. Where the wafers are from and where the die are going both matter for export and tariffs; we say which route we recommend in the quote.
How many wafers can you handle?
Small lots, from a part of one wafer upwards. Tell us the count and we will say whether the partner takes it.
Can you do the bonding afterwards?
Yes. Dicing followed by chip-on-board bonding is the usual route for open-shuttle wafers.